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Showing results: 256 - 270 of 607 items found.

  • Automated Optical Inspection (AOI)

    TR7550 SII - Test Research, Inc.

    Combining a 3CCD top-view color camera with four angled cameras for unparalleled inspection coverage, the TR7550 SII automated optical inspection system offers TRI' hallmark on-the-fly Dynamic Imaging technology for high speed vibration free pre/post reflow inspection. The system features a highly flexible RGB+W lighting system with low-angle illumination for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies.

  • MXI Computerized Tomography (CT) Option

    Nordson Corporation

    The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.

  • Review System

    RV-3000 - Toray Engineering Co., Ltd.

    Reduces surface inspection device review time and contributes to greater inspection efficiency! This system uses address information for defects detected by surface inspection equipment to acquire images of defects with a high level of magnification, and categorizes defect types.

  • Wafer Level Test

    Chroma ATE Inc.

    Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.

  • Inspection Cameras

    PCE Instruments

    The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.

  • Automated Optical Inspection (AOI)

    TR7700 SII - Test Research, Inc.

    Featuring a large 4 MP color camera and capable of inspection speeds of up to 120 cm2/sec at 15 µm, the TR7700 SII automated optical inspection system offers TRI' trademark Dynamic Imaging technology for powerful pre/post reflow inspection in a slimmer, faster and more economical package. The system features an advanced, highly flexible RGB+W lighting system with ultra-low-angle lighting for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies.

  • Automated Optical Inspection (AOI)

    TR7500 SII - Test Research, Inc.

    Featuring a large FOV 3-CCD color camera and four angled cameras, the TR7500 SII automated optical inspection offers double the scanning speed of TR7500 with identical inspection performance in an inline solution. The system is capable of high performance inspection at resolutions ranging from 10 to 15 µm, utilizing TRI' hallmark on-the-fly Dynamic Imaging technology for powerful pre/post reflow inspection without generating vibration associated with stop-and-go systems.

  • High Resolution Inline AXI Platform

    AXI XS Series - Nordson Corporation

    The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.

  • PV Cell Inspection

    GP Solar GmbH

    Solar developed a complete solution for stand-alone optical quality sorting, complete with inspection, classification and handling. The system allows implementation of automated optical inspection without changing existing machines.

  • Post Wire and Die Bond Inspection Machine

    IV-T3300 - In.D Solution

    IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.

  • Universal Offline AXI Systems

    AXI XT-6 Series - Nordson Corporation

    The XT-series provides the advanced inspection capability of Nordson TEST & INSPECTION's inline system in a smaller footprint manual load/island of automation system. The platforms are designed for flexibility and ease of use for a wide variety of products requiring 2D and 2.5D automated X-ray inspection. The XT-6/XT-6A platform is a highly flexible automated X-ray inspection system with minimum footprint and a parallel-kinematic Hexaglide manipulation unit for extreme-angle off-axis image acquisition with high resolution. It is suitable for high-quality X-ray analysis of electronic assemblies and material analysis of parts that require flexible part manipulation with multiple inspection angles. For batch modes and volume inspection the XT-6 can be equipped with a single-sided conveyor setup and magazine load/unload station (XT-6A).

  • Auto Macro Wafer Defect Inspection

    EagleView - Microtronic, Inc.

    EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.

  • Automated Optical Inspection (AOI)

    TR7502DT - Test Research, Inc.

    Equipped with a 1-CCD high resolution color camera, the TR7502 DT desktop automated optical inspection system offers TRI' hallmark Dynamic Imaging technology for powerful pre/post reflow inspection in a compact economical solution. The system features a highly flexible coax‌ial RGB+W lighting system with low-angle lighting for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies

  • PV Module Inspection

    GP Solar GmbH

    INSPECTION SYSTEMS FOR PROCESS OPTIMIZATION AND QUALITY CONTROL IN THIN-FILM MODULE PRODUCTION

  • Optical VisionInspection System

    Nidec-Read Corporation

    NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.

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